Research
 
 
 

Sponsored projects*:

Funding agency Topic P.I. Co-P.I. Budget (INR) Duration
QuInAs, UK ULTRARAM memory Avirup Dasgupta - Undisclosed 2023-24
Science and Engineering Research Board, Govt. of India A Systematic Design of Robust Memory Cell Using Ferroelectric FET (FeFET) for AI Hardware Accelerator Anand Bulusu Avirup Dasgupta, Nitanshu Chauhan 40.2 Lacs 2024-27
Semiconductor Research Corporation (SRC) Machine Learning augmented SPICE Models for Efficient Circuit Design Avirup Dasgupta Sourajeet Roy ~34.8 Lacs 2022-2025
SMILE, IIT Roorkee THz Characterization System N. Pathak, D. Singh, A. Patnaik, A. Kumar Sah, E. Sharma, M. Rawat, A. Bulusu, B. P. Das, S. Roy, B. Sarkar, S. Dasgupta, S. Kumar, K. Rawat, R. Panigrahi, U. Dey, Gowrish B., A. Dasgupta, D. Bhatt, R. Kumar, A. Samanta, R. Sharma 650 Lacs
Indian Institute of Technology Roorkee Analysis and Modeling of Ultra-thin Semiconductors for Future Technology Nodes Avirup Dasgupta - 21.9 Lacs 2022-2025
Indian Institute of Technology Roorkee Matching Grant for Variability Aware Compact Modeling of Nanosheet FETs Avirup Dasgupta - 9.5 Lacs 2021-2023
Science and Engineering Research Board, Govt. of India Variability Aware Compact Modeling of Nanosheet FETs Avirup Dasgupta - 31.61 Lacs 2021-2023
Berkeley Device Modeling Center (BDMC), UC Berkeley Compact modeling of advanced semiconductor devices Avirup Dasgupta - 92 Lacs 2021-2026
Faculty Initiation Grant, IIT Roorkee Modeling and simulation of stacked nanosheet FETs for upcoming technology nodes Avirup Dasgupta - 20.00 Lacs 2021-2023
INanoBio Consultant: device design Avirup Dasgupta - Undisclosed 2020
*Some sponsored projects are not listed due to existing confidentiality agreements.
 
 
 

Collaborations*:

Collaborator Topic
University of Lancaster, UK Novel logic and memory architectures
Compact Model Coalition, Si2 BSIM compact model development
Texas Instruments Device and circuit Modeling
Siemens Device and circuit Modeling
GlobalFoundries Engg. Pvt. Ltd. Non-volatile memory, Machine learning augmented Compact Models
Berkeley Device Modeling Center (BDMC), UC Berkeley Compact modeling of advanced semiconductor devices
BSIM group, UC Berkeley Research for BSIM models
Semiconductor Research Corporation Machine learning augmented Compact Models
CHIMES, Penn. State Univ. Design and modeling of contacts and interconnects
University of North Dakota, USA 2D materials
IIT Ropar Design and modeling of contacts and interconnects
QTT group, IIT Kanpur 2D materials and FETs
Nanolab, IIT Kanpur Modeling of semiconductor devices
IIT Jodhpur Compact modeling
IIT Hyderabad 2D materials and 2D FETs
*Some collaborations are not listed due to existing confidentiality agreements.